PCB制程中金属化孔镀层空洞的成因及改善
Research on the causes & control of through-hole voids for PCB process
程骄 1李卫明 1刘敏然1
作者信息
- 1. 广东东硕科技有限公司，广东 广州 510288
- 折叠
摘要
文章从印制线路板的生产流程和工艺参数等方面，结合切片观察的手段，浅析了金属化孔镀层空洞的形成原因。研究表明：半固化片的型号、含胶量及填料的比例与芯板质量有很大关联，影响着层压和钻孔工序的板件质量；沉铜和电镀工序的工艺参数、周边辅助设施的工作状况及加工过程中的时效是影响镀层空洞的主要因素。针对每一个异常点，找到缺陷的形成原因，对工艺流程进行有效的改进，有的放矢的起到预防措施，最终达到改善镀层质量，提高产品的合格率，对提高线路板可靠性具有重要的意义。
Abstract
Voids in plated through-holes are caused by many different processing problems. This paper will show how to identify rim voids by PCB production process¶meter with micro section observation. The results indicate that stronger correlation existed in core board between the proportion of rubber polymer to ifller and type of PP, which could inlfuence the quality of lamination and drill. The primary reason of VPTH formed was by process parameter, the condition of assisting machine and processing time for electroless and electroplate process. The reason of defect was found for every abnormal board. Effective improvement measures not only had a deifnite object in view of prevention measures, but also improved quality and percent of certiifed products, this measure had the vital signiifcance to improve reliability of printed circuit board.
关键词
空洞/化学沉铜/电镀/钻孔Key words
Void PTH/Electroless Copper Plating/Electroplating/Drill引用本文复制引用
出版年
2013
NETL
NSTL
维普
万方数据