This article mainly introduces the product process development of high aspect ratio metallized blind holes to achieve device crimping function.Through the process of charge coupled device(CCD)controlled deep drilling after metallized blind holes are pressed,the alignment accuracy of the two drilling processes of the same hole is controlled,and the metallized blind holes meet the design requirements of crimping signal module devices.The technical problem of traditional crimping hole design that can only be through holes and cannot achieve metallized blind hole crimping is successfully solved.
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