Through a simplified hybrid printed circuit board(PCB)reliability test model,this paper studies the hybird between our typical very low loss materials,ultra low loss materials,and middle loss,high Tg FR4 materials,compares the reliability difference under different laminated design and material collocation conditions,and finds out the influence law of various key factors of material collocation in laminated design on the reliability,which has positive meaning for hybrid PCB technology.
high speed materialhybrid laminationlaminated designreliability
万方数据
维普
