摘要
通过简化的混压可靠性测试模型,研究了一种典型的极低损耗、超低损耗材料与中损耗、高Tg的FR-4材料之间的混压情况.对比在不同的叠层设计和材料搭配条件下的可靠性差异,找出了叠层设计中材料搭配的各关键因子对可靠性的影响规律,对混压技术的提升具有积极的意义.
Abstract
Through a simplified hybrid printed circuit board(PCB)reliability test model,this paper studies the hybird between our typical very low loss materials,ultra low loss materials,and middle loss,high Tg FR4 materials,compares the reliability difference under different laminated design and material collocation conditions,and finds out the influence law of various key factors of material collocation in laminated design on the reliability,which has positive meaning for hybrid PCB technology.
基金项目
东莞市重点领域研发项目(20201200300022)
维普
万方数据