The interposer board connects the upper and lower high density interconnector(HDI)boards through stacking assembly technology,which can reduce the volume of electronic products and achieve more application functions.This type of product has high requirements for pattern accuracy,resin plugging hole,copper thickness,and solder mask ink thickness.In the production process,it is necessary to combine specific product requirements and technical requirements,select appropriate production processes and materials,and strictly control process parameters to ensure the quality and performance of the interposer board.This article stresses the difficulty and control skill in the process,providing guidance to improve the technique in the production of interposer board.
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