首页|基于高分子电压诱导变阻膜的全PCB抗脉冲防护

基于高分子电压诱导变阻膜的全PCB抗脉冲防护

Anti-pulse protection of whole circuit board based on polymer voltage-induced rheostatic film

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随着芯片集成度的不断提高,内部互连导线间距越来越小,器件更易在静电作用下受到损害.为提高印制电路板(PCB)在实际应用中抗静电放电(ESD)和电磁脉冲(EMP)的能力,制作了一种高分子电压诱导变阻膜,将其嵌入PCB中形成脉冲吸收网络,使全板具备抗瞬变脉冲能力,实现对ESD和EMP的全系统防护.ESD防护实测结果表明,对比普通PCB,全抗脉冲PCB对静电脉冲有更快的响应速度和更高的释放效率;传输线脉冲(TLP)测试结果表明,采用电压诱导变阻膜的PCB中每一点都具有过电压脉冲吸收能力,电流泄放能力可达50 A以上.
With the continuous improvement of chip integration,the interconnect wire spacing becomes smaller and smaller,so the device is more vulnerable to electrostatic damage.In order to improve the ability of the printed circuit board(PCB)to resist electrostatic discharge(ESD)and electromagnetic pulse(EMP)in practical applications,a polymer voltage-induced rheostatic film is prepared and embedded into the PCB to form a pulse absorption network,so that the entire circuit board has the ability to resist transient pulse and realize the whole system protection against ESD and EMP.The measured results of ESD protection show that compared with the ordinary circuit board,the full resistance pulse circuit board has faster response speed and higher release efficiency to the electrostatic pulses;the transmission line pulse(TLP)test results show that each point with the circuit board of the voltage-induced rheostatic film has the overvoltage pulse absorption capacity,and the current discharge capacity can reach more than 50 A.

electrostatic discharge(ESD)transmission line pulse(TLP)testelectromagnetic pulse(EMP)rheostatic film

刘辉、吴丰顺、武占成、龚德权、王晶、胡元伟、马浩轩

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华中科技大学材料科学与工程学院,湖北 武汉 430074

中国航天五院五一四所 院士专家工作站,北京 100086

武汉芯宝科技有限公司,湖北武汉 430043

静电放电(ESD) 传输线脉冲(TLP)测试 电磁脉冲(EMP) 变阻膜

湖北省科技厅重点项目

ZZCXZZYF2022000614

2024

印制电路信息
中国印制电路行业协会

印制电路信息

影响因子:0.243
ISSN:1009-0096
年,卷(期):2024.32(1)
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