In the quality evaluation of high-density assembly solder joints,dye and pull test is not only simple,efficient and easy to operate,but also has the most comprehensive feedback information.Based on the standard test methods,this paper expounds the basic principle and operation method of dye and pull test.Based on the typical case analysis of failure mode,this paper systematically studies the specific forms of common quality defects in ball grid array(BGA)solder joints and their mechanism in dye and pull tests,so as to provide technical reference for reliability analysis engineers in actual tests.
关键词
染色与渗透试验/球栅阵列封装(BGA)焊接质量/焊点开裂
Key words
dye and pull test/ball grid array(BGA)welding quality/solder joint cracking
维普
万方数据