In the quality evaluation of high-density assembly solder joints,dye and pull test is not only simple,efficient and easy to operate,but also has the most comprehensive feedback information.Based on the standard test methods,this paper expounds the basic principle and operation method of dye and pull test.Based on the typical case analysis of failure mode,this paper systematically studies the specific forms of common quality defects in ball grid array(BGA)solder joints and their mechanism in dye and pull tests,so as to provide technical reference for reliability analysis engineers in actual tests.
dye and pull testball grid array(BGA)welding qualitysolder joint cracking
维普
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