The main research object of this paper is a four-layer high-frequency printed circuit board(PCB)with the structure of"core board+prepreg(PP)+core board".In view of its low PP fluidity,the high-pressure pressing will lead to serious layer deviation problem.Different plate arrangement methods are adopted,including PIN+LAM,electromagnetic hot melt+PIN,rivet+PIN.This paper studies the influence of different plate arrangement methods on the alignment between layers,and analyzes the different plate arrangement methods based on the layer deviation data,so as to provide theoretical support for improving the similar PCB layer deviation problem.
关键词
高频/电磁热熔/层压/层偏
Key words
high frequency/electromagnetic hot melt/lamination/layer deviation
维普
万方数据