In the process of production,transportation and use,printed circuit board assembly(PCBA)will be subjected to various stresses,and when PCBA is overloaded,it will lead to cracking,short circuit,burnout and other failure problems.In this paper,taking PCBA burnout failure as an example,through the morphology observation,non-destructive testing,electrical performance testing,slice analysis and other methods,the cause of burnout and the failure mechanism are clarified,and suggestions for improvement are put forward.
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