摘要
印制电路板组装(PCBA)在生产、运输、使用过程中会受到各种应力.当PCBA受力过载时,就会导致开裂、短路、烧毁等失效问题发生.以PCBA烧毁失效为例,通过形貌观察、无损检测、电性能测试、切片分析等方法,明确其烧毁原因与失效机理,并提出改善建议.
Abstract
In the process of production,transportation and use,printed circuit board assembly(PCBA)will be subjected to various stresses,and when PCBA is overloaded,it will lead to cracking,short circuit,burnout and other failure problems.In this paper,taking PCBA burnout failure as an example,through the morphology observation,non-destructive testing,electrical performance testing,slice analysis and other methods,the cause of burnout and the failure mechanism are clarified,and suggestions for improvement are put forward.
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