评估旋转拼板避免玻纤效应的试验
An experiment to evaluate the glass fiber weave effects in rotating panelization
黄涛1
作者信息
- 1. 珠海斗门超毅实业有限公司互联技术中心,广东 珠海 519180
- 折叠
摘要
高速印制电路板(PCB)如何避免设计和制造端的玻纤效应已有较多的解决方案.在设计已经固定时,在制造阶段旋转拼板是一种较常见的方案,多数拼板旋转角度参考行业内建议的5°~15°,但这种方法对物料成本、制造成本及时间成本有极大的浪费.生产实践中,建议剪裁实际产品的高速通道作为测试条,通过时域反射计(TDR)测试差分对内传输时延差(skew)和2根单线的阻抗差异对差分对的对称性进行统计分析,得到合适的生产拼板旋转角度.最后利用向量网络分析仪(VNA),对不同旋转角度差分对频域性能进行测试,并验证TDR测试结论.整个试验方案节省了大量的测试成本和物料成本,可为在高速PCB的加工制造中避免玻纤效应提供参考.
Abstract
High-speed printed circuit boards(PCB)have long been plagued by the issue of glass fiber weave effects,and various solutions have been discussed in both the design and manufacturing stages.One common approach in the manufacturing stage is the use of board rotation during panelization,with recommended rotation angles ranging from 5° to 15° according to industry guidelines.However,this method entails significant waste in terms of material,manufacturing,and time costs.In practical production,it is suggested to utilize the actual high-speed channels of the product as device under test(DUT)and employ time domain reflectometry(TDR)to statistically analyze the skew of differential pairs and the impedance difference between two single-ended lines to assess the symmetry of differential pairs.This approach allows for determining the appropriate rotation angle for panelization in production.Furthermore,the conclusions drawn from TDR testing can be validated by performing frequency domain performance testing on differential pairs using a vector network analyzer(VNA).This experimental approach significantly reduces testing and material costs,providing a reference for evaluating glass fiber weave effects in the manufacturing of high-speed PCBs.Therefore,this study proposes an evaluation method for addressing the glass fiber weave effects in the fabrication of high-speed PCBs,which can effectively save costs and provide valuable insights for the industry.
关键词
印制电路板/玻纤效应/时域反射计/时延差Key words
printed circuit board(PCB)/glass fiber weave effect/time domain reflectometry(TDR)/skew引用本文复制引用
出版年
2024