With the continuous development of mobile phone communication and consumer products in the direction of light,thin,small,fine,dense and other design features,the design requirements of high density interconnector(HDI)printed circuit board(PCB)products used in supporting products are getting higher and higher,and the process design and specification control in the production process are becoming more and more stringent.In this paper,through the study of the influence of heat treatment process on the crystal microstructure and the physical properties of plating copper in the PCB manufacturing process,and the comprehensive characteristics of product quality in the copper plating post-process,the importance of fully identifying microstructure changes of products and the potential impact on product quality,and the signficance of optimizing the design of the production process for the successful production and application reliability of high-end fine PCB products are discussed.
NETL
NSTL
维普
万方数据
