BGA焊点微裂纹缺陷检测研究
Research on detection of microcrack defects in BGA solder joints
牛浩浩 1张祎彤 1陈奎1
作者信息
- 1. 航空工业集团西安航空计算技术研究所,陕西 西安 710065
- 折叠
摘要
球栅阵列封装(BGA)元器件的焊点隐藏于IC芯片底部,经电装后仅边缘焊点可见,因此检验其焊接质量是行业普遍的难题.探讨了BGA焊点微裂纹缺陷的产生机理和裂纹分布,设计了基于计算机分层层析成像(CL)技术的BGA焊点微裂纹缺陷检测方法和检测流程.经实测证明,该测试方法可以兼顾检测质量和效率,具有工程应用的可行性,可为BGA焊点检验人员提供参考.
Abstract
The solder joints of ball grid array(BGA)packaging components are hidden at the bottom of the integrated circuit(IC)chip,and only the solder joints near the edge are visible after electronic assembly,so that the welding quality testing is a difficult task in the industry.This article mainly explores the mechanism and distribution of microcracks in BGA solder joints,and designs a detection method and process for microcracks in BGA solder joints based on computed laminography(CL)technology.The actual measurement proves that this testing method can balance detection quality and efficiency,and has the feasibility of engineering application,providing reference for BGA solder joint inspection personnel.
关键词
BGA焊点/微裂纹/缺陷检测/CL技术Key words
ball grid array(BGA)solder joint/microcracks/defect detection/computed laminography(CL)technology引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据