超大尺寸不溶性阳极溶铜工艺脉冲电镀研究
Study on pulse electroplating of ultra large size insoluble anodic copper dissolution process
刘德威 1叶汉雄 1陈俊1
作者信息
- 1. 惠州中京电子科技有限公司,广东 惠州 519029
- 折叠
摘要
研究了超大尺寸不溶性阳极溶铜工艺脉冲电镀,探索超大尺寸电镀均匀性、不溶性阳极+溶铜粒工艺+脉冲电镀的电镀能力与药水的稳定性.经过试验开发,使超大尺寸不溶性阳极+溶铜粒工艺+脉冲电镀实现了均匀的电镀,提高了电镀的生产效率,其工艺在设备保养、药水维护、成本节约等方面有明显的优势.
Abstract
We mainly study the pulse electroplating process of ultra large size insoluble anodic dissolution copper,exploring the uniformity of ultra large size electroplating,the electroplating ability and solution stability of insoluble anode+copper particle dissolution process+pulse electroplating.Through experimental development,ultra large plates can achieve uniform electroplating through insoluble anode+dissolved copper particle dissolution process+pulse electroplating,which improves electroplating production efficiency and has obvious advantages in equipment maintenance,medicine maintenance,cost savings,and other aspects of the insoluble anode+copper particle dissolution process.
关键词
超大尺寸/不溶性阳极/溶铜工艺/脉冲电镀Key words
ultra large size/insoluble anode/copper siddolution process/pulse electroplating引用本文复制引用
出版年
2024
NETL
NSTL
万方数据