回流焊后浸锡面变色探究
Exploration of discoloration of immersion tin after reflow soldering
嵇富晟 1杨淳钦 1杨淳杰 1陈兴国1
作者信息
- 1. 苏杭科技有限公司,江苏 涟水 223400
- 折叠
摘要
浸锡被广泛应用于印制电路板(PCB)表面涂覆工艺中.锡面变色是常见的技术难题.结合生产实例探讨PCB浸锡工艺中锡面变色的产生原因和机理,从减少锡面晶格破坏、杜绝后处理药水反噬等方面进行阐述分析,达到查找真因、制定相应措施的目的.按照工艺流程使用逐项排查、交叉分析、试验模拟、反向验证等各种方式寻求真因,并作多次生产验证,制定标准化措施,监控执行力度,杜绝相同问题再次发生.
Abstract
Immersion tin is widely used in printed circuit board(PCB)surface process,but tin surface discoloration is a common technical problem.This paper discusses the causes and mechanisms of tin surface discoloration in PCB immersion tin process combined with production examples,including reducing tin surface lattice damage,eliminating post-treatment potion's influence and other aspects of analysis,so as to find the real cause and formulate corresponding measures.Various methods such as item by item investigation,cross analysis,experimental simulation,and reverse verification are carried out according to the process flow to seek the true cause,and multiple production verifications are carried out to develop standardized measures and monitor the execution intensity,so as to achieve the goal of preventing problems from happening again.
关键词
浸锡/晶格/喷砂/变色/回流焊测试Key words
immersion tin/crystal lattice/pumice/discoloration/reflow test引用本文复制引用
出版年
2024
NETL
NSTL
万方数据