无枝状结晶耐离子迁移覆盖膜的研究
Study on anti-ion migration coverlay without dendrite
茹敬宏 1陈兰香 1曾令辉 1王志勇1
作者信息
- 1. 国家电子电路基材工程技术研究中心,广东生益科技股份有限公司,广东 东莞 523808
- 折叠
摘要
挠性印制电路板(FPCB)的离子迁移主要受挠性覆铜板(FCCL)和覆盖膜胶层的影响,表现为线路间的枝状结晶.考察采用环氧胶、聚酰亚胺胶等胶黏剂制备覆盖膜的耐离子迁移性,观察耐离子迁移性测试后的试样形貌,发现不同类型胶黏剂制备的覆盖膜试样枝状结晶程度不一,其中普通环氧胶覆盖膜试样线路间枝状结晶严重.进一步通过胶黏剂配方研究,开发出一种无枝状结晶的环氧胶覆盖膜,性能满足IPC-4203标准要求.
Abstract
The ion migration of flexible printed circuit board is characterized by dendrite between circuits,which is mainly affected by adhesive of flexible copper clad laminate and coverlay.In this paper,the ion migration of coverlay prepared by using epoxy adhesive,polyimide adhesive and other adhesives is investigated.It is found that the degree of dendrite is different in the coverlay samples prepared by different kinds of adhesives,and the dendrite is serious in the common epoxy coverlay samples.A kind of non-dendritic epoxy coverlay is developed,which can meet the requirements of IPC-4203 standard.
关键词
覆盖膜/耐离子迁移性/枝状结晶/胶黏剂/环氧树脂Key words
coverlay/anti-ion migration/dendrite/adhesive/epoxy resin引用本文复制引用
出版年
2024
NETL
NSTL
万方数据