一种厚铜刚挠结合印制电路板的开发
Development of a thick copper rigid flexible PCB
王义锋 1刘兴文 1马忠义 1申峻宇 1付学明 1苏俊文 1胥明春1
作者信息
- 1. 成都航天通信设备有限责任公司,四川 成都 610000
- 折叠
摘要
为适应各种环境下的需求,军用电子设备正朝着小型化、轻量化及高可靠性方向发展.军用大电流产品存在原用线束装配方式占用结构空间大、装配时间长及装配一致性差的问题,可以使用刚挠结合印制电路板(RFPCB)对其大电流线束进行替代.阐述了此类RFPCB的大电流过流仿真设计过程和制造过程中遇到的层压空洞问题的压合工艺攻关过程,提出了一种RFPCB替代大电流线束的技术方案.
Abstract
In order to meet the needs of various environments,military electronic equipment is developing towards miniaturization,lightweight,and high reliability.A military high current product has problems with the original wiring harness assembly method including large space occupation,long assembly time,and poor assembly consistency.The high current wiring harness can be replaced by rigid flexible printed circuit board(RFPCB).This article discusses the simulation design process and manufacturing process of technological research and development,with the pressing process for eliminating laminated voids as the emphasis.A technical solution is developed to replace high current wire harnesses with RFPCBs.
关键词
厚铜/刚挠结合印制板/层压空洞/压合工艺Key words
thick copper/rigid flexible printed circuit board(PCB)/laminated voids/pressing process引用本文复制引用
出版年
2024
NETL
NSTL
万方数据