中温固化有胶挠性覆铜板的研制
Study on preparation of mid-temperature curing FCCL with adhesive
左陈 1陈兰香 1曾令辉1
作者信息
- 1. 广东生益科技股份有限公司 国家电子电路基材工程技术研究中心,广东 东莞 523808
- 折叠
摘要
研究了一种中温固化有胶挠性覆铜板(FCCL)的配方及工艺,并考察了E-51环氧树脂、多官能环氧树脂对FCCL性能的影响.研究结果表明,在配方中添加E-51环氧树脂可以有效提高胶黏剂的流动性,从而改善涂胶聚酰亚胺(PI)膜的压合性,减少压合铜箔后所产生的气泡,但是配方中添加E-51环氧树脂会缩短胶水的适用期;当多官能环氧树脂用量超过15%时,固化后的胶黏剂脆性变大,当固化温度≥90℃时,FCCL的性能趋于稳定.对比测试结果表明,制备的中温固化FCCL的基本性能与生益科技常规产品SF305基本相当,可满足挠性印制电路板(FPCB)的应用要求.
Abstract
This article studies the formula and process of a mid-temperature curing flexible copper clad laminate with adhesive(3L-FCCL).The influence of E-51 epoxy and multi-functional epoxy on the 3L-FCCL is also investigated.The result shows that E-51 epoxy can help to improve the fluidity of the adhesive and reduce the bubble occurrence of coating PI film after being covered with copper foil.The adhesive becomes brittle when the multi-functional epoxy is added more than 15%in the formula.The curing degree of adhesive could be improved by raising curing temperature.The performance of 3L-FCCL tends to be stable when curing temperature exceeds 90℃.The comparison test result shows that the mid-temperature curing 3L-FCCL has the basic performance equivalent to that of SF305 which is the conventional product of Shengyi Technology Co.,Ltd.and can meet the application requirement of FCCL.
关键词
挠性覆铜板(FCCL)/中温固化/环氧树脂/剥离强度/耐热性Key words
flexible copper clad laminate(FCCL)/mid-temperature curing/epoxy resin/peel strength/heat resistance引用本文复制引用
出版年
2024
NETL
NSTL
万方数据