This article studies the effect of connecting pad design on the gold thickness of the replacement gold system by designing several common immersion gold connecting pads and measuring the gold thickness of the connecting pads after electroless nickel electroless palladium immersion gold(ENEPIG)(replacement gold system).After analyzing the experimental results,it is found that under the same processing conditions,the thickness of the gold-plated connecting pad decreased with the increase of the gold-plated connecting pad area.When the area of the connecting pad is smaller than a certain value,the gold thickness of the solder mask defined(SMD)connecting pad decreases compared with that of the non solder mask defined(NSMD)connecting pad.For connecting pads of the same design and size,there is a negative correlation between the gold thickness of the connecting pad and the area of the connected immersio gold connecting pad or copper surface.
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