Solder mask is an organic-inorganic composite material,and the structure and performance of solder mask ink will directly affect the reliability of printed circuit board(PCB).Mastering the impact of the two main structures of solder mask ink on its performance and reliability has guiding significance of solder mask ink materials.This study adjusts the dispersion of inorganic fillers and organic photothermal reaction rates of solder mask inks by adjusting baking parameters and photothermal curing conditions,and analyzes the effects of inorganic filler dispersion and photothermal reaction rates on the performance of solder mask inks and the reliability of PCBs.The results show that under current experimental conditions,the photothermal reaction rate of solder mask ink has a greater impact on its performance and the reliability of PCBs.
NETL
NSTL
万方数据
