阻焊油墨结构对其性能及可靠性的影响
Study on the influence of structure of solder mask ink on its performance and reliability
杨智勤 1李玉龙 1李小新 1熊佳 1魏炜1
作者信息
- 1. 广州广芯封装基板有限公司,广东广州 510555
- 折叠
摘要
阻焊油墨作为有机-无机复合材料,其结构及性能会直接影响印制电路板(PCB)的可靠性.阻焊油墨的主要结构包括有机结构和无机结构,掌握阻焊油墨2种主要结构对其性能及PCB可靠性的影响具有重要的指导意义.通过调控烘烤参数和光热固化条件来调节阻焊油墨无机填料的分散及有机光热反应率,并分析了无机填料分散情况和有机光热反应率对阻焊油墨的性能及PCB可靠性的影响.结果表明,在当前实验条件下,阻焊油墨的光热反应率对其性能和PCB的可靠性影响较大.
Abstract
Solder mask is an organic-inorganic composite material,and the structure and performance of solder mask ink will directly affect the reliability of printed circuit board(PCB).Mastering the impact of the two main structures of solder mask ink on its performance and reliability has guiding significance of solder mask ink materials.This study adjusts the dispersion of inorganic fillers and organic photothermal reaction rates of solder mask inks by adjusting baking parameters and photothermal curing conditions,and analyzes the effects of inorganic filler dispersion and photothermal reaction rates on the performance of solder mask inks and the reliability of PCBs.The results show that under current experimental conditions,the photothermal reaction rate of solder mask ink has a greater impact on its performance and the reliability of PCBs.
关键词
印制电路板/阻焊油墨/材料结构/光热固化Key words
printed circuit board(PCB)/solder mask ink/material structure/photothermal curing引用本文复制引用
出版年
2024
NETL
NSTL
万方数据