Development is an important process in the production of printed circuit board(PCB)circuit pattern.The dry film matter suspended in the developing solution is very easy to cause short circuit defects in the product line,the formation of scrap,and the increase in production costs.This paper analyses and explores the causes of dry film development suspension by designing comparative experiments to effectively reduce the short circuit defective rate,hoping to provide some reference for similar problems.
printed circuit board(PCB)developmentsuspended matter of dry filmcircuit pattern
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