化学镀镍/金PCB焊点失效分析
The failure analysis of the solder joint in ENIG PCB
胡金山 1夏宝山 2陈庆国2
作者信息
- 1. 金宝电子(铜陵)有限公司,安徽铜陵 244000
- 2. 安徽国家铜铅锌及制品质量监督检验中心,安徽铜陵 244000;国家印制电路板质量检验检测中心,安徽铜陵 244000
- 折叠
摘要
以印制电路板(PCB)焊点焊接不良为例,通过外观检查、扫描电子显微镜(SEM)和能量色散谱(EDS)分析及切片分析等方法,分析其失效机理与原因.通过SEM发现焊盘表面镀层有严重龟裂的现象,镍层裂纹暴露于空气中后发生氧化反应而出现连续镍层腐蚀现象,这是最终导致焊盘表面上锡不良的主要诱因.
Abstract
The failure mechanism and cause of printed circuit board(PCB)solder joints are analyzed by means of appearance inspection,scanning electron microscope(SEM)& energy dispersive spectrometer(EDS)analysis and microsectioning taking welding defect as an example.Through SEM observation,it is found that the surface coating of the pad has serious honeycomb cracks,nickel layer cracks are exposed to air and then oxidized,resulting in continuous nickel layer corrosion,which is the main cause of dewetting on the pad surface.
关键词
焊接不良/裂纹/镍层腐蚀Key words
welding defect/crack/nickel layer corrosion引用本文复制引用
出版年
2024
NETL
NSTL
万方数据