混压多层板隔层半固化片相互影响的研究
Study of the interaction of the compartment prepregs in the hybrid lamination multilayer PCB
潘俊健 1王小兵 1周彪1
作者信息
- 1. 广东生益科技股份有限公司,广东 东莞 523000
- 折叠
摘要
印制电路板(PCB)行业面临着性能提升和成本降低的挑战,因此混压PCB的应用越来越广泛.但混压结构的多层PCB如果存在基板材料之间不兼容问题,则有可能导致分层爆板、翘曲超标等品质缺陷.以一款高速材料与FR-4材料的混压板为研究对象,该混压板在耐热性测试后FR-4半固化片(PP)层出现玻璃纱裂,通过材料特性分析、不同叠层设计下PP固化反应研究,证明了不同材料的PP之间虽然隔着芯板层,但PP在层压过程中释放出的物质依然可以穿透芯板层去影响另一层PP的反应.
Abstract
Printed circuit board(PCB)industry is facing the challenge of performance improvement and cost reduction.So the hybrid lamination PCB will be applied more and more widely.However,if there is incompatibility between substrate materials for multilayer PCB with hybrid lamination structure,it may lead to quality defects such as delamination,warpage and so on.In this paper,a hybrid lamination PCB containing high-speed material and FR-4 material is studied.After the heat resistance test of the hybrid lamination PCB,the glass yarn cracks appear in the FR-4 prepreg layer.Through the analysis of material characteristics and the study of curing reaction of the prepreg under different stack-up designs,we have proved that although the core layer separates the prepregs of different materials,the substances released from the prepreg during the process of lamination can still penetrate the core layer to affect the reaction of another layer of prepreg.
关键词
印制电路板(PCB)/混压/半固化片(PP)Key words
printed circuit board(PCB)/hybrid lamination/prepreg(PP)引用本文复制引用
出版年
2024
NETL
NSTL
万方数据