In the printed circuit board(PCB)manufacturing process,it is needed to reduce the scrap rate and adapt to the current increasingly strict impedance control environment.This paper analyzes the data of the influence factors such as material dielectric constant,impedance specification,solder mask dielectric constant,and differential line pitch specification,and defines the influence degree of the above factors through the impedance change value,so as to give the impedance control method of PCB semi-finished products before solder resist.
关键词
阻抗/印制电路板/管控/阻焊前后
Key words
impedance/rinted circuit board(PCB)/control/before and after solder resist
维普
万方数据