The reasons for the warping problem of the thick copper type large assembled printed circuit board(PCB)for power storage are analyzed,especially involving the changes of the warping under different conditions of materials,processing technology and reflow soldering.Through the orthogonal design of experiments(DOE)to verify the true cause of the warping of the power storage thick copper type large assembled PCB,it is finally concluded that the warping has an important influence on the matching of the substrate material and prepreg(PP)(adhesive sheet).At the same time,the control of the lamination parameters and the baking plate parameters in the process will have a certain promoting effect on improving the warping.At last,improvement measures are also proposed,so as to provide a reference for the technical workers of peer enterprises to solve such problems.
large assembled printed circuit board(PCB)warpingmeridional and latitudinal directionsmixed pressure
万方数据
维普
