The transmission link contains conductor line and via in printed circuit board(PCB).Research results show that the length of the stub has the greatest influence on the via impedance with a proportion of 27%.Therefore,how to make the back drilling stub shorter becomes one of the key paths to improve the impedance consistency.Because of the different inner image design of PCB,as the number of layers increases,the board thickness range also increases,which makes the control of back drilling stub more difficult.This paper studies the influence of each influence factor on the length of back drilling stub.The research shows that based on 3D back drilling technology,through the control of each influence factor,the back drilling stub shorter than 150 μm can be realized.
万方数据
维普
