This article conducts in-depth analysis and research on the problem of single blind hole ommission in via filling plating.Through comparative verification,the root cause of the problem is identified.The results show that the omission of filling of single blind hole is caused by foreign objects obstructing the plating,and the foreign objects come from the adhesive material of the pre-treatment guide strip.After the pre-treatment guide strip is removed,the problem is solved.
关键词
印制电路板/填孔电镀/盲孔/漏填
Key words
printed circuit board(PCB)/via filling plating/blind hole/omission of filling
维普
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