With the development of semiconductor technology and mounting technology,printed circuit board(PCB)integration has further increased,and the ball grid array(BGA)area wiring density of PCB products is getting higher and higher.When high density PCB is processed by conventional pulse plating process,the difference between copper plating thickness in the BGA area and that on the large copper surface increases sharply,which brings great challenges to etching.Through characteristic factor analysis,this paper verifies the copper thickness range between BGA region and large copper surface under different current density and waveform settings,and obtains a feasible scheme to reduce the copper thickness range between BGA region and large copper surface.
万方数据
维普
