In the design of 56 bit/s motherboard of 5G base station,the design of M+2 with hybrid of high frequency material and high speed material is commonly used.For the conventional production process of the printed circuit board(PCB)with M+2 design,before the final lamination process of two sub-PCBs,it is necessary to use epoxy to plug holes of the two sub-PCBs.However,the epoxy plugging process is very time consuming,the stack-up is asymmetrical,and the board warpage affects other post processes.This paper mainly introduces a prepreg(PP)sandwich plugging process instead of the epoxy plugging process.For the board with the structure of M+2 design,this process does not need to make epoxy plugging holes before the second lamination.At the time of secondary lamination,we use PP to fill the holes can not only ensure the fullness of the hole,ensure the quality requirements of the PCB,but also reduce the processes and costs,and improve the production efficiency a lot.
high speed printed circuit board(PCB)design of M+2epoxy plugging holesprepreg(PP)plugging holes
维普
万方数据
