In the field of new energy vehicle printed circuit board(PCB),the causes of solder mask peeling defects caused by shield welding are analyzed.Based on the heat resistance characteristics of solder mask,different thicknesses of solder mask,different wavelengths for light curing,different shield design,and different heating methods are verified.Based on the experimental results,it is finally concluded that it is necessary to prevent thermal bridge effects during shield welding by special design,increasing the adhesion of solder mask,and effectively preventing the solder mask peeling during the welding process.The article also proposes improvement and preventive measures,and provides a detailed introduction to the method to improve the peeling of solder mask during the welding process by preventing thermal bridge effect and increasing solder mask adhesion.
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