Vertical conveyor plating(VCP)line,owing to its high efficiency,high stability,high precision,low cost and other advantages,has been widely used in whole plate plating,graphic plating and micro-porous plating in printed circuit board(PCB)production.In this paper,the conductive structure and electroplating principle of VCP are analyzed.Through comparative experiments,the causes of abnormal copper thickness on the vertical edge of the whole plate electroplating are studied and analyzed,and the differences in copper plating caused by poor electrical conductivity of flying palladium are effectively solved by developing corresponding measures.
维普
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