Roughening micro-etch chemical treated copper surface gets higher roughness,hence improving the adhesion between copper surface and solder mask,etc.But electroless nickel/immersion gold(ENIG)poor deposit defect was detected,after some type roughening micro-etch chemical was used without post-treatment and directly followed by the solder mask process.This article discussed the mechanism for roughening micro-etch chemical resulting in ENIG poor deposit defect.And based on test results,improvement measures are provided to prevent the ENIG poor deposit defect.
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