When CO2 laser is used to process stepped grooves,the resin and copper foil at the bottom of the groove absorb CO2 laser energy,causing the temperature of the copper foil at the bottom of the stepped groove to rise.When the copper foil at the bottom of the stepped groove is thin or the copper foil is poorly combined with the substrate at the bottom of the groove,the problem of delamination between the copper foil at the bottom of the stepped groove and the substrate often appears.In this paper,it is found through experiments that the copper foil delamination at the bottom of stepped groove is not improved by canceling the design of through holes connected with stepped groove,adjusting the laser energy and changing the type of copper foil,but it can be improved by changing the contact side of copper foil with CO2 laser in the stack.This finding provides a basis for the design of similar products in the future,avoiding the delamination of copper foil at the bottom of the stepped groove during the production process.
关键词
印制电路板/阶梯槽/分层/激光能量
Key words
printed circuit board(PCB)/stepped groove/delamination/laser energy
维普
万方数据