印制电路信息2024，Vol.32Issue(9) ：52-56.

表面镀层与无铅锡膏焊接兼容性的研究

Study on the welding compatibility of PCB final finishing and lead-free solder paste

潘浩东 蒋少强 王剑 聂富刚 王世堉 李伟明 何骁
印制电路信息2024，Vol.32Issue(9) ：52-56.
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  • 万方数据

表面镀层与无铅锡膏焊接兼容性的研究

Study on the welding compatibility of PCB final finishing and lead-free solder paste

潘浩东 1蒋少强 2王剑 2聂富刚 2王世堉 2李伟明 1何骁1
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作者信息

  • 1. 工业和信息化部电子第五研究所,广东广州 511370
  • 2. 中兴通讯股份有限公司,广东深圳 518000
  • 折叠

摘要

印制电路板组装(PCBA)中,焊点作为电气连接和机械支撑结构,对电子产品的可靠性起着至关重要的作用.以A、B 2种锡膏为研究对象,分别与有机可焊性保护层(OSP)、化学镍金(ENIG)表面处理的印制电路板(PCB)进行焊接,对形成的焊点进行焊接质量评估.结果表明锡膏A相对于锡膏B在焊接后空洞较少,在抵抗冲击方面锡膏A要更优,但剪切强度却是锡膏B更优;ENIG表面处理下焊点的抗剪切强度要优于OSP表面处理下的焊点,OSP镀层形成的金属间化合物(IMC)则更为均匀.

Abstract

Solder joints,as electrical connections and mechanical support structures,play a crucial role in the reliability of electronic products in the assembly of printed circuit boards(PCBs).This paper takes solder paste A and B as the research object,welding on PCB surfaces treated by organic solderability preservative(OSP)and electroless nickel/immersion gold(ENIG)respectively,to evaluate the welding quality of the formed solder joints.The results show that solder paste A has fewer holes after welding than solder paste B,and solder paste A has better impact resistance,but its shear strength is worse than solder paste B.The shear strength of solder joints under ENIG surface treatment is better than that under OSP surface treatment,and the inter metallic compound(IMC)formed by OSP coating is more uniform.

关键词

无铅锡膏/印制电路板镀层/焊点强度/兼容性

Key words

lead-free solder paste/coating of printed circuit board(PCB)/solder joint strength/compatibility

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出版年

2024
印制电路信息
中国印制电路行业协会

印制电路信息

影响因子：0.243
ISSN：1009-0096
参考文献量4
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