This article mainly discusses the quality issues of side erosion and detachment of white solder resist ink,analyzes the reasons for poor side erosion and detachment of ink,and compares the impact of different exposure energies,pre-treatment,and wavelengths of exposure machine light sources on the side erosion and detachment of ink through relevant experimental tests.The focus is on exploring the effects of The different light source wavelengths of the LDI exposure machine LED parallel exposure machines and halogen lamp parallel exposure machines on solder resist ink.The results show that the wavelength of the exposure machine has significant effects on the size of side erosion and poor adhesion of white solder resist ink,providing a certain reference basis for peers in the production of white solder resist ink.
white solder resist inkink detachmentwavelengthside erosion
万方数据
维普
