Modern electronic products,especially high-performance memory and communication devices,have urgent demands for efficient signal transmission and low power consumption,requiring packaging technology to exhibit excellent performance under high-frequency and high-speed conditions.Vertical wire fan-out(VFO)packaging technology uses vertical gold wires to connect the chip and the substrate,constructing a tight vertical interconnection system.This design significantly shortens the signal transmission path,reduces signal insertion loss and reflection loss,improves signal transmission speed and quality,and adapts well to high-frequency applications.Through comparative simulation,the study reveals the performance advantages of VFO packaging in high-frequency operations.The research provides reliable data support for selecting appropriate packaging technology and lays a theoretical foundation for improving the performance of traditional wire bonding packaging in high-frequency applications.
万方数据
维普
