Bismaleimide triazine(BT)resin substrates are widely used in the field of integrated circuit(IC)substrate due to their good dimension stability and high reliability.Unlike the traditional FR-4,the special properties of BT resin can cause quality issues such as poor coverage during electroless plating.This paper analyzes and verifies the factors affecting poor coverage from multiple perspectives,including substrate material type,elcetroless plating parameters,and desmear parameters.Based on the analysis and verification,improvement measures and right directions are summarized,effectively improving the electroless void defect.
万方数据
维普
