Lead-free hot air solder leveling(HASL)technology,as an important process change under the environmental requirements,is widely used in the surface treatment of printed circuit boards(PCBs).However,while improving environmental performance,the technology also faces the challenge of"tin etching copper",which directly affects the electrical performance and long-term reliability of PCBs.The purpose of this paper is to discuss the causes,influencing factors and improvement strategies of the tin etching copper phenomenon in HASL,so as to provide a scientific basis for improving the quality of lead-free HASL PCB.
关键词
无铅热风整平焊锡/锡咬铜/印制电路板/环保
Key words
lead-free hot air solder leveling/tin etching copper/PCB/environment friendly
维普
万方数据