Aiming to address the delamination issue of printed boards caused by moisture absorption and humidity during exceeded storage,this study investigates the effects of baking board parameters for various material grades and the number of baking board stacks on the water absorption rate and ΔTg value of the boards.The goal is to determine the optimal baking board parameters for different material grades.Meanwhile,various packaging methods are analyzed to ensure the high-temperature reflow heat resistance of the exceeded storage printed circuit board in heavy industry and prevent the delamination of the board.
维普
万方数据