After the complex chiplet substrate design is completed and delivered by the outsourcing company,the substrate design file we receive has limitations in the file reading or writing.This article introduces a solution to the removal of some these limitations,making the design files be useable in electrical,thermal,and stress.simulations.Thus the following upgrading and optimization,as well as the assessment of design quality,are convenient.After the functional restrictions are relieved,signal integrity simulation is performed on two pairs of differential signal lines.The simulation results are compared with those of the substrate design service company.It is shown that the simulation results of the two are very close to each other.
维普
万方数据