Study on the technology of PTFE material laser processing blind holes
Polytetrafluoroethylene(PTFE)resin substrate material,have become the mainstream choice for on-board millimeter-wave radar PCB products in the market.In this paper,the blind hole processing technology of a PTFE material using CO2+UV non-integrated laser is discussed.The results show that the maximum alignment deviation of non-integrated laser machining is 30 μm,which can be corrected by the aperture compensation of UV laser path design to ensure that the path completely covers the hole bottom;the spiral filling pattern of UV laser can solve the problem of carbide residue at the bottom of the hole processed by a single CO2 laser.The reliability of this technology is excellent.
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