首页|多层印制电路板基材涨缩稳定性研究

多层印制电路板基材涨缩稳定性研究

扫码查看
在印制电路板(PCB)的生产过程中,基材涨缩的稳定性是确保产品最终加工精度的关键因素.旨在基于涨缩超差管控经验,构建基材涨缩稳定性评价指标体系,运用方差与相关性分析这2个手段,深入研究基材涨缩稳定性与影响因子之间的关联关系.发现季节间的基材涨缩稳定性存在微弱差异,Tg、板材铜厚、开口数、板材厚度、排层率因子对基材涨缩稳定性具有显著影响,影响程度逐次降低.
Study on expansion and contraction stability of multilayer PCB substrate
In the production process of printed circuit boards(PCBs),the stability of substrate expansion and contraction is a key factor for ensuring the final processing accuracy of the product.The aim is to construct an evaluation index system for the stability of substrate expansion and contraction based on the experience of controlling excessive expansion and contraction,and to use variance and correlation analysis to deeply study the correlation between substrate expansion and contraction stability and influencing factors.It is found that there are slight differences in the stability of substrate expansion and contraction between seasons.Tg,copper thickness of the board,number of openings,board thickness,and stacking rate factors have a significant impact on the stability of substrate expansion and contraction,and the degree of influence gradually decreases.

PCBfluctuation stabilityANOVAanalysis of correlation

池飞、吴伟辉、涂紫珊、段绍华、张华勇

展开 >

江西景旺精密电路有限公司,江西 吉安 343000

江西省高端印制电路板工程技术研究中心,江西 吉安 028800

PCB 涨缩稳定性 方差分析 相关性分析

2024

印制电路信息
中国印制电路行业协会

印制电路信息

影响因子:0.243
ISSN:1009-0096
年,卷(期):2024.32(12)