Research on manufacturing technology of FPCB with high current carrying and shielding capacity
High current carrying and high shielding capacity FPCB has been applied in the field of intelligent connected vehicles or low altitude aircraft.In order to achieve the goal of improving the performance of this type of circuit board,this article analyzes and studies a flexible circuit board with shielding properties and a stepped thick copper that transitions from 245 μm copper thickness to 105 μm copper thickness.The following technologies are formed:the thick copper high current carrying hollow circuit manufacturing technology of"etching half of the copper thickness in the circuit pattern→covering the film→etching the other half of the copper thickness in the circuit pattern",the production technology of stepped thick copper high current carrying circuit,which first produces proof stepped circuits,then produces 105 μm circuits,and finally produces 245 μm circuits,the production technology of thick copper circuit by laminating and filling the covering film after browning and applying the covering film,and the production technology of silver paste shielding layer of plasma treatment first,then separately producing a silver paste layer,and finally laminating two layers of overlay film.Products made using the above technologies have high reliability.
flexible printed circuit board(FPCB)high current carryingthick copperhigh shielding
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维普
