Discussion on PCB edge plug lead elimination process
Printed circuit board edge plug crimping operation will produce relative friction,high requirements on plug resistance and conductive performance.Gold plating surface treatment process is usually adopted.The lead,as the conductive path of the edge plug gold plating process,needs to be removed after gold plating to avoid short-circuit problems.At present,manual stripping,etching and drilling are common methods for removing edge plug leads,and they all have advantages and disadvantages.This paper explores the direction of optimizing the lead design and production process through the test analysis of these three kinds of removal processes,and solves the problems of manual stripping and etching processes that are prone to lead residue,the problems of drilling process that are prone to drilling deviation and skew,etc.,so as to provide references for the processing and production of edge plug leads.