Exploration on the production of a high multi layer motherboard for server
In this paper,a method of making 30-layer backplane sample of high-speed material R-5775(G)and high-Tg material R1755V mixed-pressure structure applied in the field of AI server is introduced.The main features of the product are:high multi-layer(30 layers),high plate thickness(3.8±0.38 mm),high aspect ratio(13.5:1),high precision and mixed-pressure structure.The existing process capability of key process is evaluated,and the engineering design,technical difficulties and solutions of the product are introduced.
AI serverdielectric constantdielectric lossresin plug holeback drill
万方数据
维普
