首页|IGBT灌封用苯基改性有机硅凝胶的耐热及介电性能研究

IGBT灌封用苯基改性有机硅凝胶的耐热及介电性能研究

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  • 国家科技期刊平台
  • NETL
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随着绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)向高电压、大功率化方向发展,其产生的热量和运行温度快速上升,致使其绝缘封装系统失效问题愈发突出.为满足IGBT日益严苛的工作环境,亟需研发一种高性能的有机硅灌封材料.该文通过化学合成制备苯基改性有机硅凝胶(phenyl modified silicone gel,PMSG),研究其耐热和介电性能.结果表明:PMSG失重5%的热失重温度为383℃,室温击穿场强可达 32.62 kV/mm,比纯有机硅凝胶(pure silicone gel,PSG)提高17.42%,且150℃击穿场强相较于室温击穿场强仅下降 25.38%,展现出更优良的高温耐电特性.同时,其相比于PSG具有更低的介电损耗.因此,PMSG作为IGBT封装材料时,整体性能更加优良.该研究将为 IGBT 封装用新型高性能绝缘材料的研制提供有效思路和理论基础.
Research on Heat Resistance and Dielectric Properties of Phenyl Modified Silicone Gels for IGBT Packaging
With the development of insulated gate bipolar transistors(IGBTs)towards high voltage and high power,the heat and operating temperature they generate are escalating rapidly,thereby making the failure of their insulating package systems increasingly prominent.In order to meet the increasingly harsh working environment of IGBT,there is an urgent need to develop a high-performance silicone packaging material.In this paper,phenyl modified silicone gel(PMSG)is prepared by chemical synthesis,and heat resistance and dielectric properties of PMSG are studied emphatically.The results show that,the thermal weight loss temperature of PMSG at 5% weight loss is 383℃,and the breakdown field strength at room temperature can reach 32.62 kV/mm,which is 17.42% higher than that of pure silicone gel(PSG).And the breakdown field strength at 150℃ is only 25.38% lower than that at room temperature,which exhibits better electrical resistance at high temperatures.Meanwhile,it has lower dielectric loss compared to PSG.Therefore,when PMSG is used as an IGBT packaging material,the overall performance is better.This research will provide effective ideas and theoretical basis for the development of novel high-performance insulation materials for IGBT packaging.

phenyl modified silicone gelinsulating packagethermal stabilitybreakdown strengthelectrical resistance at high temperature

王争东、罗盟、王然、李梦力、周远航、成永红

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西安建筑科技大学机电工程学院,陕西省 西安市 710055

电力设备电气绝缘国家重点实验室(西安交通大学),陕西省 西安市 710049

苯基改性有机硅凝胶 绝缘封装 热稳定性 击穿强度 高温耐电

电力设备电气绝缘国家重点实验室开放课题陕西省科技厅青年基金陕西省产学研协同创新计划

EIPE222102022JQ-3002023YFBT-45-02

2024

10.13334/j.0258-8013.pcsee.230902

中国电机工程学报
中国电机工程学会

中国电机工程学报

CSTPCD北大核心
影响因子：2.712
ISSN：0258-8013
年,卷(期)：2024.44(14)