Fan-Out packaging for EMI electromagnetic shielding and partial shielding solutions
With the advancement of technology,electronic products have become indispensable.Fan-out packaging technology has gained attention for its performance and design flexibility,enhancing chip integration and electrical performance.However,the increasing density and complexity of high-performance electronic devices have brought about electromagnetic interference(EMI)issues,affecting device operation and signal transmission.Therefore,the development of effective electromagnetic shielding technology is crucial.This article explores EMI issues in fan-out packaging and proposes electromagnetic shielding design solutions,including the Die first approach and RDL first approach.This article summarizes the development trends in fan-out packaging technology,discuss future challenges,and provides recommendations for EMI electromagnetic shielding design,hoping to inspire future research and innovation.
万方数据
维普
