3D integrated broadband microwave delay line based on the MEMS technology
To meet the miniaturization requirements of broadband phased array antennas,a broadband 4-bit microwave delay line 3D heterogeneous integrator was designed using microelectromechanical systems(MEMS)3D integration technology.The working frequency of the delay device covers 8GHz to 15GHz,and the device integrates GaAs chips,COMS chips,and fixed microwave delay line.The device has the functions of RF signal delay control,gain compensation and power supply synchronous modulation.The device size is 20mm×20mm×1.3mm,with a weight of 1.35g.The back of the device is the ground.The device is installed by the microassembly process.The input/output port connects to the transmission by bonding line mode.The test results show that the delay fluctuation is≤3ps,insertion loss is≤22dB,port VSWR≤1.5,and the amplitude consistency of each delay bit state is≤±1dB.
万方数据
维普
