Research on packaging technology and reliability of semiconductor devices
This paper focuses on exploring and analyzing the reliability of semiconductor device packaging technology and technical application,so as to improve the high-quality application of semiconductor devices in various environments.The analysis of the packaging technology of semiconductor devices,such as packaging process,chip protection,electrical function implementation,etc.,can provide an effective way to improve the durability and stability of the package by combining theory and practice.At the same time,it is optimized for the reliability of packaging technology applications.The research data show that the optimized semiconductor device packaging technology can extend the service life of the equipment itself and provide favorable technical support for the application of high-performance electronic equipment.
万方数据
维普
