Design of electrostatic protection for adhesive development equipment
The article takes the harm and generation mechanism of static electricity as an extension to analyze how semiconductor coating and developing equipment can achieve static discharge in design details,manufacturing and debugging stages,and avoid the impact of static electricity.Firstly,the design scheme for controlling static electricity in the microenvironment of adhesive development equipment was elaborated through the application of electrostatic eliminators and STHC.Then,the background of the use of EFLOW and anti-static tubes was introduced from the liquid DIW used in the adhesive development equipment and the transmission scheme of organic solvents,with a focus on the electrostatic grounding method of the NTD unit.Finally,an analysis was conducted on the material selection and manufacturing process for the design of spin unit components.
adhesive development equipmentelectrostatic dischargeelectrostatic eliminatorEFLOW
万方数据
维普
