首页|One-step constructing advanced N-doped carbon@metal nitride as ultra-stable electrocatalysts via urea plasma under room temperature

One-step constructing advanced N-doped carbon@metal nitride as ultra-stable electrocatalysts via urea plasma under room temperature

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Highly active transition metal nitrides are desirable for electrocatalytic reactions,but their long-term sta-bility is still unsatisfactory and thus limiting commercial applications.Herein,for the first time,we report a unique and universal room-temperature urea plasma method for controllable synthesis of N-doped car-bon coated metal(Fe,Co,Ni,etc.)nitrides arrays electrocatalysts.The preformed metal oxides arrays can be successfully converted into metal nitrides arrays with preserved nanostructures and a thin layer of N-doped carbon(N-C)via one-step urea plasma.Typically,as a representative case,N-C@CoN nanowire arrays are illustrated and corresponding formation mechanism by plasma is proposed.Notably,the de-signed N-C@CoN catalysts deliver excellent electrocatalytic activity and long-term stability both in oxy-gen evolution reaction(OER)and urea oxidation reaction(UOR).For OER,a low overpotential(264 mV at 10mA/cm2)and high stability(＞50h at 20 mA/cm2)are acquired.For UOR,a current density of 100mA/cm2 is achieved at only 1.39 V and maintain over 100 h.Theoretical calculations reveal that the synergetic coupling effect of CoN and N-C can significantly facilitate the charge-transfer process,optimize adsorbed intermediates binding strength and further greatly decrease the energy barrier.This strategy provides a novel method for fabrication of N-C@metal nitrides as highly active and stable catalysts.

Urea plasmaMetal nitridesCarbon shellOxygen evolution reactionUrea oxidation reaction

Tao Tang、Chen Li、Sipu Li、Zhong Qiu、Tianqi Yang、Beirong Ye、Shaojun Shi、Chunyang Wu、Feng Cao、Xinhui Xia、Minghua Chen、Xinqi Liang、Xinping He、Xin Liu、Yongqi Zhang

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Institute of Fundamental and Frontier Science,University of Electronic Science and Technology of China,Chengdu 611731,China

Department of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China

College of Materials Science & Engineering,Zhejiang University of Technology,Hangzhou 310014,China

School of Chemistry and Materials Engineering,Changshu Institute of Technology,Changshu 215500,China

State Key Laboratory of Electronic Thin Film and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 611731,China

Department of Engineering Technology,Huzhou College,Huzhou 313000,China

State Key Laboratory of Photocatalysis on Energy and Environment,Fuzhou University,Fuzhou 350116,China

Key Laboratory of Engineering Dielectric and Applications(Ministry of Education),School of Electrical and Electronic Engineering,Harbin University of Science and Technology,Harbin 150080,China

State Key Laboratory of New Textile Materials and Advanced Processing Technologies,Wuhan Textile University,Wuhan 430200,China

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2024

10.1016/j.cclet.2024.109887

中国化学快报(英文版)
中国化学会

中国化学快报(英文版)

CSTPCD
影响因子：0.771
ISSN：1001-8417
年,卷(期)：2024.35(11)