首页|无溶剂型双组分有机硅改性PU胶粘剂的制备与性能研究

无溶剂型双组分有机硅改性PU胶粘剂的制备与性能研究

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以聚醚二元醇(DL-1000)、4,4′-二苯基甲烷二异氰酸酯(MDI)为主要原料合成端-NCO基PU(聚氨酯)预聚体;然后以γ-氨丙基三乙氧基硅烷(KH-550)对其进行嵌段共聚改性,并以3,3′-二氯-4,4′-二氨基二苯基甲烷(MOCA)/蓖麻油作为复合固化剂,制备出无溶剂型双组分有机硅改性PU胶粘剂.研究结果表明:硅烷键已引入PU胶粘剂中;随着KH-550含量的不断增加,胶粘剂的黏度增大、固化时间缩短、室温剪切强度下降且耐热性增强;通过调节不同KH-550含量,可制备出不同性能要求的胶粘剂;该胶粘剂的玻璃化转变温度(-45.9℃)相对较低,说明其耐寒性相对较好.
Study on preparation and properties of solvent-free two-components PU adhesive modified by organic-silicone
With polyether diol(DL-1000) ,MDI(4,4'-diphenyl methane diisocyanate) as main raw materials, a PU(polyurethane) prepolymer with -NCO-tenninal group was prepared. Then a solvent-free two-components PU adhesive modified by organic-silicone was made with KH-550 as modifier of block copolymer and MOCA/castor oil as composite curing agent. The research results showed that the silane-bond was introduced into PU adhesives. The adhesives with different properties requirements could be made by regulating different KH-550 contents because the viscosity and thermal stability of adhesive were increased,but the curing time and shear strength at room temperature of adhesive were decreased with increasing KH-550 contents. The adhesive had reversely better cold resistance because its glass transition temperature(-45.9 ℃) was reversely lower.

solvent-freeorganic-siliconetwo-componentspolyurethaneadhesive

张银钟、胡孝勇、袁晓玲、陈锦凡

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广西工学院生物与化学工程系,广西柳州545006

江门亿源生化工程有限公司,广东江门529000

无溶剂 有机硅 双组分 聚氨酯 胶粘剂

2012

中国胶粘剂
上海市合成树脂研究所 全国粘合剂信息站 中国胶粘剂和胶粘带工业协会

中国胶粘剂

CSTPCD北大核心
影响因子:0.522
ISSN:1004-2849
年,卷(期):2012.21(2)
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